Manufacturers looking for ceramics with high heat dissipation and thermal conductivity choose our aluminum nitride substrate. Our proprietary thick-film screening process is designed to print copper on our aluminum nitride substrate, making our product an ideal substrate for compact, high-density hybrids.

    Our aluminum nitride has a thermal coefficient of expansion as low as 3.5x10(-6) making it a perfect match with a silicon wafer. The thermal conductivity of our substrate exceeds 200W/mK, delivering 10x more head conductivity then alumina. Compared to BeO, Beryllium Oxide, this material is non-toxic and environmentally friendly.

Thin & Thick Film Use

* As-Fired - fully dense substrates with an as-fired finish of 4 micro- inch or better.

* Lapped - precisely flat and parallel substrate within 1 micrometer.

* Polished - we supply AlN for demanding thin-film applications which require the best optical finish, as fine as 20 Angstroms.